找到“Without”相关的规格书共5,131个
| 型号 | 厂商 | 描述 | 数据手册 | 替代料 | 参考价格 |
|---|---|---|---|---|---|
| 0877593664 | MOLEX10[MolexElectronicsLtd.] | 0877593664 - 2.00mm (.079) Pitch Milli-Gridâ„¢ Header, Surface Mount, Vertical, 36 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs - Molex Electronics Ltd. | 获取价格 | ||
| 0877593465 | MOLEX10[MolexElectronicsLtd.] | 0877593465 - 2.00mm (.079) Pitch Milli-Gridâ„¢ Header, Surface Mount, Vertical, 34 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs - Molex Electronics Ltd. | 获取价格 | ||
| 0877593275 | MOLEX10[MolexElectronicsLtd.] | 0877593275 - 2.00mm (.079) Pitch Milli-Gridâ„¢ Header, Surface Mount, Vertical, 32 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs - Molex Electronics Ltd. | 获取价格 | ||
| 0877593075 | MOLEX10[MolexElectronicsLtd.] | 0877593075 - 2.00mm (.079) Pitch Milli-Gridâ„¢ Header, Surface Mount, Vertical, 30 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs - Molex Electronics Ltd. | 获取价格 | ||
| 70567-0275 | MOLEX2[MolexElectronicsLtd.] | 70567-0275 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 | ||
| 0877592274 | MOLEX10[MolexElectronicsLtd.] | 0877592274 - 2.00mm (.079) Pitch Milli-Gridâ„¢ Header, Surface Mount, Vertical, 22 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs - Molex Electronics Ltd. | 获取价格 | ||
| 70567-0168 | MOLEX2[MolexElectronicsLtd.] | 70567-0168 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 68 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 | ||
| 70567-0167 | MOLEX2[MolexElectronicsLtd.] | 70567-0167 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 66 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 | ||
| 70567-0163 | MOLEX2[MolexElectronicsLtd.] | 70567-0163 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 58 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 | ||
| 70567-0148 | MOLEX2[MolexElectronicsLtd.] | 70567-0148 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 28 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 | ||
| 70567-0146 | MOLEX2[MolexElectronicsLtd.] | 70567-0146 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 24 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 | ||
| 70567-0141 | MOLEX2[MolexElectronicsLtd.] | 70567-0141 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 14 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 | ||
| 70567-0140 | MOLEX2[MolexElectronicsLtd.] | 70567-0140 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 12 Circuits, 0.76μm (30μ") Gold (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 | ||
| 70567-0138 | MOLEX2[MolexElectronicsLtd.] | 70567-0138 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating - Molex Electronics Ltd. | 获取价格 | ||
| 70567-0018 | MOLEX2[MolexElectronicsLtd.] | 70567-0018 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 40 Circuits, Tin (Sn) Plating - Molex Electronics Ltd. | 获取价格 | ||
| 70567-0008 | MOLEX2[MolexElectronicsLtd.] | 70567-0008 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, Tin (Sn) Plating - Molex Electronics Ltd. | 获取价格 | ||
| 70567-0003 | MOLEX2[MolexElectronicsLtd.] | 70567-0003 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, Tin (Sn) Plating - Molex Electronics Ltd. | 获取价格 | ||
| 0877591814 | MOLEX10[MolexElectronicsLtd.] | 0877591814 - 2.00mm (.079) Pitch Milli-Gridâ„¢ Header, Surface Mount, Vertical, 18 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, Lead-free - Molex Electronics Ltd. | 获取价格 | ||
| 0877591665 | MOLEX10[MolexElectronicsLtd.] | 0877591665 - 2.00mm (.079) Pitch Milli-Gridâ„¢ Header, Surface Mount, Vertical, 16 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs - Molex Electronics Ltd. | 获取价格 | ||
| 67926-0312 | MOLEX8[MolexElectronicsLtd.] | 67926-0312 - 3.81mm (.150") Pitch Serial ATA IDT Power Receptacle, 0.76mm (30m") Gold (Au)Plating, 20AWG, without Latch, with Bump, Lead free - Molex Electronics Ltd. | 获取价格 |
