找到“TLC551CDBLE”相关的规格书共1,076个
| 型号 | 厂商 | 描述 | 数据手册 | 替代料 | 参考价格 |
|---|---|---|---|---|---|
| 58866-0002 | MOLEX7[MolexElectronicsLtd.] | 58866-0002 - HMC™ Rectangular Industrial End Bell Cap Assembly, PG36, 14.00 to 18.00mm (.551to .709") dia. Wire Size, Blue Bush, for External Threaded Hoods - Molex Electronics Ltd. | 获取价格 | ||
| 0737802164 | MOLEX8[MolexElectronicsLtd.] | 0737802164 - 2.00mm (.079") Pitch HDM® Board-to-Board Daughtercard Receptacle, Vertical, SignalModule, 72 Circuits, Mounted Height 14.00mm (.551"), Pin Length 4.00mm (.157"), - Molex Electronics Ltd. | 获取价格 | ||
| 0737801244 | MOLEX8[MolexElectronicsLtd.] | 0737801244 - 2.00mm (.079") Pitch HDM® Board-to-Board Daughtercard Receptacle, Vertical, Signal Module, 144 Circuits, Mounted Height 14.00mm (.551"), Pin Length 3.00mm (.118"), Solder Tail - Molex Electronics Ltd. | 获取价格 | ||
| 0737801164 | MOLEX8[MolexElectronicsLtd.] | 0737801164 - 2.00mm (.079") Pitch HDM® Board-to-Board Daughtercard Receptacle, Vertical, SignalModule, 144 Circuits, Mounted Height 14.00mm (.551"), Pin Length 4.00mm (.157"), - Molex Electronics Ltd. | 获取价格 | ||
| 0737800244 | MOLEX8[MolexElectronicsLtd.] | 0737800244 - 2.00mm (.079") Pitch HDM® Board-to-Board Daughtercard Receptacle, Vertical, SignalModule, 72 Circuits, Mounted Height 14.00mm (.551"), Pin Length 3.00mm (.118"), - Molex Electronics Ltd. | 获取价格 | ||
| 53647-1474 | MOLEX7[MolexElectronicsLtd.] | 53647-1474 - 0.635mm (.025") Pitch SlimStack™ Header, Surface Mount, Dual Row, VerticalStacking, 8.00 and 14.00mm (.315 and .551") Stacking Heights, Lead-free, 140Circuits, with Embossed Tape with Cover Packaging - Molex Electronics Ltd. | 获取价格 | ||
| 53647-1274 | MOLEX7[MolexElectronicsLtd.] | 53647-1274 - 0.635mm (.025") Pitch SlimStack™ Header, Surface Mount, Dual Row, VerticalStacking, 8.00 and 14.00mm (.315 and .551") Stacking Heights, Lead-free, 120Circuits, with Embossed Tape with Cover Packaging - Molex Electronics Ltd. | 获取价格 | ||
| 53647-1074 | MOLEX7[MolexElectronicsLtd.] | 53647-1074 - 0.635mm (.025") Pitch SlimStack™ Header, Surface Mount, Dual Row, VerticalStacking, 8.00 and 14.00mm (.315 and .551") Stacking Heights, Lead-free, 100Circuits, with Embossed Tape with Cover Packaging - Molex Electronics Ltd. | 获取价格 | ||
| 0536470874 | MOLEX7[MolexElectronicsLtd.] | 0536470874 - 0.635mm (.025") Pitch SlimStackâ„¢ Header, Surface Mount, Dual Row, VerticalStacking, 8.00 and 14.00mm (.315 and .551") Stacking Heights, Lead-free, 80 Circuitswith Embossed Tape with Cover Packaging - Molex Electronics Ltd. | 获取价格 | ||
| 0536470374 | MOLEX7[MolexElectronicsLtd.] | 0536470374 - 0.635mm (.025") Pitch SlimStackâ„¢ Header, Surface Mount, Dual Row, VerticalStacking, 8.00 and 14.00mm (.315 and .551") Stacking Heights, Lead-free, 30 Circuitswith Embossed Tape with Cover Packaging - Molex Electronics Ltd. | 获取价格 | ||
| 0536470274 | MOLEX7[MolexElectronicsLtd.] | 0536470274 - 0.635mm (.025") Pitch SlimStackâ„¢ Header, Surface Mount, Dual Row, VerticalStacking, 8.00 and 14.00mm (.315 and .551") Stacking Heights, Lead-free, 20 Circuitswith Embossed Tape with Cover Packaging - Molex Electronics Ltd. | 获取价格 | ||
| 73780-3864 | MOLEX8[MolexElectronicsLtd.] | 73780-3864 - 2.00mm (.079") Pitch HDM® Board-to-Board Daughtercard Receptacle, Vertical, SignalModule, 144 Circuits, Mounted Height 14.00mm (.551"), Pin Length 4.00mm (.157"), - Molex Electronics Ltd. | 获取价格 | ||
| 73780-1234 | MOLEX8[MolexElectronicsLtd.] | 73780-1234 - 2.00mm (.079") Pitch HDM® Board-to-Board Daughtercard Receptacle, Vertical, SignalModule, 144 Circuits, Mounted Height 14.00mm (.551"), Pin Length 2.00mm (.079"), - Molex Electronics Ltd. | 获取价格 | ||
| 73780-0244 | MOLEX8[MolexElectronicsLtd.] | 73780-0244 - 2.00mm (.079") Pitch HDM® Board-to-Board Daughtercard Receptacle, Vertical, SignalModule, 72 Circuits, Mounted Height 14.00mm (.551"), Pin Length 3.00mm (.118"), - Molex Electronics Ltd. | 获取价格 | ||
| 53647-0874 | MOLEX7[MolexElectronicsLtd.] | 53647-0874 - 0.635mm (.025") Pitch SlimStack™ Header, Surface Mount, Dual Row, VerticalStacking, 8.00 and 14.00mm (.315 and .551") Stacking Heights, Lead-free, 80 Circuitswith Embossed Tape with Cover Packaging - Molex Electronics Ltd. | 获取价格 | ||
| 53647-0474 | MOLEX7[MolexElectronicsLtd.] | 53647-0474 - 0.635mm (.025") Pitch SlimStack™ Header, Surface Mount, Dual Row, VerticalStacking, 8.00 and 14.00mm (.315 and .551") Stacking Heights, Lead-free, 40 Circuitswith Embossed Tape with Cover Packaging - Molex Electronics Ltd. | 获取价格 | ||
| 0588660002 | MOLEX7[MolexElectronicsLtd.] | 0588660002 - HMCâ„¢ Rectangular Industrial End Bell Cap Assembly, PG36, 14.00 to 18.00mm (.551to .709") dia. Wire Size, Blue Bush, for External Threaded Hoods - Molex Electronics Ltd. | 获取价格 | ||
| 0536471474 | MOLEX7[MolexElectronicsLtd.] | 0536471474 - 0.635mm (.025") Pitch SlimStackâ„¢ Header, Surface Mount, Dual Row, VerticalStacking, 8.00 and 14.00mm (.315 and .551") Stacking Heights, Lead-free, 140Circuits, with Embossed Tape with Cover Packaging - Molex Electronics Ltd. | 获取价格 | ||
| 74300-3144 | MOLEX8[MolexElectronicsLtd.] | 74300-3144 - 2.00mm (.079") Pitch HDM® Board-to-Board Daughtercard Receptacle, Vertical, SignalModule, with Guide, 144 Circuits, Mounted Height 14.00mm (.551"), Press-Fit Pin - Molex Electronics Ltd. | 获取价格 | ||
| 74300-1144 | MOLEX8[MolexElectronicsLtd.] | 74300-1144 - 2.00mm (.079") Pitch HDM® Board-to-Board Daughtercard Receptacle, Vertical, SignalModule, with Guide, 144 Circuits, Mounted Height 14.00mm (.551"), Press-Fit Pin - Molex Electronics Ltd. | 获取价格 |
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